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X-ray inspection equipment×アイビット - List of Manufacturers, Suppliers, Companies and Products

X-ray inspection equipment Product List

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A must-see for companies that don't want to fail in selecting X-ray equipment! *Technical materials available.

A must-see for companies that don't want to fail in selecting X-ray equipment! *Technical materials available.

Did you find the "resolution" you imagined based on the numbers in the catalog? A thorough explanation of the key points needed for selecting X-ray equipment! *Real machine tests are also being accepted.

It's dangerous to trust only the catalog! Did you know that in actual devices, large > small, high > low, and bright > dark can be reversed when only comparing numerical values? Some companies may not be aware that they are not obtaining images with the resolution they imagined from the X-ray equipment they are currently using. This document thoroughly explains the necessary points for appropriate equipment selection from various perspectives! We provide all the comparative data of two products with different tube currents using the JIMA test chart. ★ You can view the table of contents from the "PDF Download." If you would like the complete version, please apply through "Contact Us." [Content (excerpt)] ■ Differences between catalog specifications and actual image resolution ■ How X-rays are generated ■ Differences between geometric magnification and monitor magnification ■ The impact of X-rays on semiconductor components * Additionally, we offer verification using actual devices that clearly shows the differences in resolution. About 80% of the companies that conducted the tests have made purchases! If you're interested, please feel free to contact us.

  • X-ray inspection equipment

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3D stereo inline X-ray inspection device ILX-1100/2000

3D stereo inline X-ray inspection device ILX-1100/2000

The cost reduction of inline automatic inspection has been achieved through the 3D X-ray stereo method!

This product is an inline inspection device that automatically inspects the solder joints of mounted circuit boards using X-rays. In high-density circuit boards, the solder joints are located on the bottom surface of the components (face down), making visual inspection impossible. It is suitable for inspecting components like QFN/SON, where the solder joints are on the bottom surface of the components. 【Features】 - Safe design, no qualifications required for handling X-rays - Compact and space-saving, enabling inline X-ray inspection - Can inspect without being affected by the backside of double-sided mounted circuit boards - Capable of 3D tomographic inspection using X-ray stereo method - Supports small circuit boards (50×50mm) to large sizes (510×460mm) - Capable of inspecting bottom-soldered components like BGA using X-ray stereo method *For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment

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3D X-ray inspection device 'FX-400tRX with CT'

3D X-ray inspection device 'FX-400tRX with CT'

X-ray stereo method! The resolution has improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section.

This product is an X-ray inspection device that can slice a printed circuit board from the top surface to the bottom surface into 300 layers using X-ray stereo technology (our proprietary technology). The resolution has increased threefold from the conventional 100-layer cross-section to a 300-layer cross-section. The X-ray output is 110kV, 200μA, with a resolution of 2μm. It comes standard with a chip counter function and allows selection from three types of CT methods. 【Features】 ■ X-ray stereo technology (our proprietary technology) ■ Slices the printed circuit board from the top surface to the bottom surface into 300 layers ■ Resolution improved threefold from the conventional 100-layer cross-section to a 300-layer cross-section ■ X-ray output of 110kV, 200μA, with a resolution of 2μm ■ Three types of CT methods (V-CT, diagonal CT, stereo CT) *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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"FX-300tRX2 with CT" chip counter function

"FX-300tRX2 with CT" chip counter function

This is an introduction to the standard-equipped chip counter function of the X-ray stereo 3D X-ray inspection device.

This product is an X-ray inspection device newly equipped with a chip counter function. The chip counter function counts the number of electronic components within embossed tape wound on a reel by using X-ray transmission images. The tape reel can be set in the device as it is, and by pressing the count button, the quantity of "components in the reel" is counted in about 30 seconds. The counted quantity is linked to a barcode and output as a CSV file. 【Features】 ■ Can accommodate tape reels with a diameter of up to 250mm ■ Chip counting possible in about 30 seconds per reel ■ Barcode compatible, CSV output compatible (BC reader not included) ■ Capable of counting chips of size C0402 *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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[Exhibition Participation] High-Resolution Offline X-Ray Inspection Equipment

[Exhibition Participation] High-Resolution Offline X-Ray Inspection Equipment

We will hold an exhibition in Okayama for two days on November 21-22. We will showcase the offline X-ray inspection device: FX-400tRX.

We will be exhibiting our 【X-ray inspection equipment】 at the "MUSUBI Okayama Exhibition" to be held from November 21 (Tuesday) to November 22 (Wednesday). ■ Equipment exhibited by Aibit: Offline X-ray Inspection System: FX-400tRX - Surface and back surface cancellation of the mounted circuit board using X-ray stereo method (approximately 4-5 seconds) - Acquisition of 300 layers of horizontal cross-section of the mounted circuit board using X-ray stereo CT method - High-output X-ray source with 110kV, 200µA - Acquisition of fine images with a high resolution of 2μm - Automatic inspection using CT function (OK/NG judgment) In addition to the equipment being exhibited this time, we have various other devices tailored to customer applications. Please feel free to contact us. 【Demonstration on the day】 Sample imaging can be performed using your samples. Please contact us in advance with your preferred date and time, as well as sample details. If you wish to have a demonstration at the venue, please let us know. *Please note that if there is no prior contact, it may not be possible to conduct imaging on the day according to the schedule. 【Exhibition Overview】 Period: November 21 (Tuesday) to November 22 (Wednesday) Venue: Okayama "Convex Okayama Small Exhibition Hall" For more details, please contact us.

  • X-ray inspection equipment

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IC wire bonding X-ray inspection device 'LFX-1000R'

IC wire bonding X-ray inspection device 'LFX-1000R'

This is an introduction to a device that uses X-rays to perform radiographic inspection of the internal condition of reel-shaped IC components.

The IC wire bonding X-ray inspection device "LFX-1000R" is a device that uses X-rays to perform radiographic inspection of the internal condition of reel-type IC components. While winding the ICs from the tape reel, it automatically inspects the connection status of the wire bonding for each individual IC (Good/NG judgment). The compatible reel dimensions range from 180 to 380 mm. 【Features】 ■ Compatible reel dimensions: 180 to 380 mm ■ Radiographic inspection of the internal condition of IC components using X-rays ■ Automatic inspection of the connection status of wire bonding for each individual IC ■ A lead frame compatible type "LFX-1000" is also available *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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[Company Overview] The Lineage of Ibit Corporation

[Company Overview] The Lineage of Ibit Corporation

Awards for technological development! Our company has been involved in the development, clarification, and release of various devices.

Our company has been involved in the development, clarification, and release of various devices. For example, we developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers and clarified the mechanism of vacuum soldering. We also have a history of receiving awards for technological development and being recognized as an excellent company. [Career Highlights (Excerpt)] ■2003: Introduced "Hydrogen/Vacuum/Heating Furnace" into X-ray equipment Clarified the mechanism of vacuum soldering ■2004: Developed a 12,000,000 pixel camera (4,000x3,000) for high-speed inspection of 300mm wafers ■2005: Merged X-ray equipment with die bonders, integrating chip mounting functions ■2006: Developed a fully automated inspection machine for crystal defect voids in Si wafers *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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Invitation to the Opening of the Ivy Bit Osaka Demo Room

Invitation to the Opening of the Ivy Bit Osaka Demo Room

You can experience "backside cancellation," which allows for accurate X-ray inspection of the circuit board by removing the components implemented on the backside. Verification and experimentation of the circuit board can be conducted with equipment from seven companies.

Aibit has opened a demonstration room called "MUSUBI Osaka Labo" in Shin-Osaka, where equipment from seven companies related to semiconductor manufacturing is gathered. It is also possible to validate and experiment with substrates using our X-ray inspection equipment, and you can experience how our unique "X-ray stereo method" resolves the difficulty of inspecting substrates that overlap and are hard to see in just 4 seconds. 【Demonstration Room Overview】 Location: 1-7-27 Nishinomiya-hara, Yodogawa-ku, Osaka City, Osaka Prefecture Business Hours: Weekdays 9:00 AM to 5:00 PM (About a 10-minute walk from JR Shin-Osaka Station) *For more details, please refer to the materials. Feel free to contact us as well.

  • others

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3D stereo inline X-ray inspection device ILX1000/2000

3D stereo inline X-ray inspection device ILX1000/2000

Inspection is possible only on the surface of the double-sided implementation substrate! Also compatible with 3D tomography inspection. *Detailed explanatory materials will be provided.

The "ILX-1000/2000" is an inline X-ray inspection device that automatically inspects the soldering areas of mounted circuit boards. Thanks to our unique inspection method, it supports separate inspections of the front and back surfaces of the circuit board. It is not affected by the back side of double-sided mounted boards. Additionally, 3D tomography inspection is also possible. It is suitable for inspecting soldering areas of BGA/CSP components and components like QFN/SON that have soldering on the bottom surface. 【Features】 ■ Capable of inspecting bottom-soldered components such as BGA ■ Can cancel out components on the back side of the board for inspection ■ Supports small boards (50×50mm) to large sizes (510×460mm) ■ Compact and space-saving, suitable for inline use *We are currently offering detailed materials that explain the product. Please refer to those for more information.

  • Semiconductor inspection/test equipment
  • X-ray inspection equipment

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Announcement of the seminar "Analysis Methods for Defective Substrates Using X-ray Equipment"

Announcement of the seminar "Analysis Methods for Defective Substrates Using X-ray Equipment"

Seminar held at the Implementation and Assembly Process Technology Exhibition 2024 in Kumamoto! We will introduce methods for defect analysis using X-rays and methods for identifying the causes of defects.

At the exhibition "Assembly and Mounting Process Technology Exhibition 2024 in Kumamoto," organized by 19 manufacturers of mounting equipment and post-mounting process manufacturers, we will hold a free seminar on "Analysis Methods for Defective Boards Using X-ray Equipment." In this seminar, we will introduce X-ray inspection methods, analysis methods for defects using X-rays, and ways to identify the causes of defects. We will also cover defect cases such as "defects caused by bubbles in inner layer vias" and "defects caused by cracks in board through-holes." We look forward to your attendance. 【Event Overview】 ■ Date and Time - November 28, 2024 (Thursday) 15:00 - 16:00 - November 29, 2024 (Friday) 10:15 - 11:15 ■ Venue: Gran Messe Kumamoto Conference Room ■ Address: 1010 Fukutomi, Mashiki Town, Kamimashiki District, Kumamoto Prefecture ■ Participation Fee: Free *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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Invitation to the exhibition "Implementation and Assembly Process Technology Exhibition"

Invitation to the exhibition "Implementation and Assembly Process Technology Exhibition"

We plan to release a number of X-ray inspection devices (offline inspection devices, inline assembly inspection devices, reel-compatible inspection, etc.)!

Aibit Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition" held at Haibu Nagaoka (Niigata). At this exhibition, you will be able to see new equipment from various manufacturers that continue to support quality improvement and productivity enhancement in production sites. We plan to showcase a 3D X-ray observation device, a 3D X-ray stereo method observation device, and a 3D X-ray stereo method inline X-ray inspection device. 【Event Overview】 ■ Date: April 24 (Thursday) to April 25 (Friday), 2025 ■ Time: 10:00 AM to 5:00 PM (Last admission at 4:00 PM) ■ Admission Fee: Free ■ Venue: Haibu Nagaoka, 1st Floor Full Hall *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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High Magnification X-ray Inspection Device 'FX-300tRR'

High Magnification X-ray Inspection Device 'FX-300tRR'

Reel-to-reel inspection function added! 3D imaging is also possible with the optional CT unit.

The "FX-300tRR" is a high-magnification X-ray inspection device that allows for easy inspection of electronic components on reels. It retains the performance and functionality of the conventional model FX-300tR2 while offering "high magnification of 900x for 2D inspection, vertical 0° to diagonal 60°," "reel-to-reel inspection," and analysis with "3D-CT," making it a multifunctional product that serves three roles in one device. Additionally, by changing the tray, it can also perform solder inspection of mounted circuit boards and inspections using JEDEC standard trays. 【Features】 ■ Allows for photographic confirmation of individual components while still on the reel ■ Capable of inspecting 3,000 reel components in about one hour ■ Automatic operation allows for image storage of all components ■ Inspection of reel components with an inclined X-ray camera is also possible ■ The VCT function significantly improves shooting operability, enabling not only radiographic inspection but also three-dimensional analysis *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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Notice of Participation in the Exhibition "The 1st Kansai Nepcon Japan"

Notice of Participation in the Exhibition "The 1st Kansai Nepcon Japan"

We plan to unveil inline X-ray inspection equipment and 3D X-ray inspection equipment!

Aibit Inc. will be exhibiting at the "1st [Kansai] Nepcon Japan - Electronics Development and Implementation Exhibition" held at Intex Osaka. At this exhibition, cutting-edge electronic components, materials, and manufacturing, implementation, and inspection equipment that support the multifunctionality and high performance of electronic devices will be showcased. Manufacturers from various sectors such as electronics, semiconductors and sensors, electronic components, automotive and electrical equipment, and aerospace will attend for the introduction and comparative study of advanced technologies. Our company plans to exhibit inline X-ray inspection equipment and 3D X-ray inspection equipment. 【Event Overview】 ■ Dates: May 14 (Wed) - 16 (Fri), 2025 ■ Hours: 10:00 AM - 5:00 PM ■ Admission Fee: Free ■ Venue: Intex Osaka *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment
  • X-ray Inspection Machine

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3D X-ray stereo method X-ray inspection device 'FX-400tRX'

3D X-ray stereo method X-ray inspection device 'FX-400tRX'

Fully utilize CT functions with easy operation! Achieving high resolution of 2μm while being a sealed X-ray device.

The "FX-400tRX" is a 3D X-ray stereo inspection device capable of obtaining clear X-ray images with a geometric magnification of 500 times. It can also inspect the connection points of IC wire bonding and copper wires. Additionally, it can inspect through-holes inside printed circuit boards. With a high output of 110kV and 200μA, it has become possible to penetrate materials such as 3mm thick copper plates. 【Features】 ■ High output X-ray source of 110kV and 200μA allows penetration of copper plates (3mm) ■ High resolution of 2μm enables image acquisition of fine details ■ High magnification imaging with geometric magnification of 500 times ■ X-ray stereo method allows separation of the front and back surfaces of the mounted circuit board (approximately 4 seconds) ■ X-ray stereo CT method enables acquisition of 500 horizontal cross-sections of the mounted circuit board *For more details, please download the PDF or feel free to contact us.

  • X-ray inspection equipment

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